Shanghai San Guang Electronical Alloy Co., Ltd.
Main products:Fe Cr Alloy Wire,Ni Wire,Nichrome Wire,Fe Cr Alloy Wire,Ni Trip
Products
Contact Us
  • Contact Person : Mr. Ji Weiping
  • Company Name : Shanghai San Guang Electronical Alloy Co., Ltd.
  • Tel : 86-21-56917136
  • Fax : 86-21-56917036
  • Address : Shanghai,Shanghai,Pingliang Road,Yangpu Region,Shanghai Province
  • Country/Region : China
  • Zip : 200093

wafer cutting line

wafer cutting line
Product Detailed
silicon cutting line 1.free sample offered; 2.good quality and service; 3.have a long using life; 4.small quantity accepted.

silicon cutting line

2types: 680/spool, 360/spool

0.1mm----16.0 yuan/km, 0.11mm----15.0yuan/km, 0.12mm----13.0yuan/km

1,Saving materials 2,Cutting precision 3,Cutting speed 4,No collapse 5,Reduction of environmental pollution

Diamond cutting lines of crystalline silicon

1,Saving materials

Diamond cutting crack is small and rate of piece is high, it can reach 90%, saving material greatly.2,Cutting precision 

Accuracy of cutting material can be achieved, and the surface is smooth, it can be polished directly after cutting, eliminating the grinding process, saving time and materials.3,Cutting speed

Diamond cutting wire cutting speed is faster, greatly improving the work efficiency.4,No collapse 

While cutting a variety of hard and brittle material, collapsing edges are less than 10mm, can be avoided easily give rise to the inner circle cutting edge or the bottom of the crack.5,Reduction of environmental pollution

Cutting by water cutting, can prevent pieces of powder pollution and maintain the working environment of materials and equipment clean.

Features:1,Our diamond cutting wire use electroplating principle, diamond coated on a high-tensile steel wire. After special treatment, diamond is not easy to fall off and using lift is long.

2,Length is more than 100Km.

3,The speed is faster than common cutting wire and loss of wire is smaller. Greatly improving the work efficiency and reducing waste.3-4

4,Cutting by water and do not need recycle, can prevent pieces of powder pollution and maintain the working 

environment of materials and equipment clean.

5,Cutting crack is less than 10mm. The piece rate is high, it can reach 90%, saving material greatly.

wafer cutting line



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